Most electronic components come in standardized packages. A package type has well a defined set of physical dimensions that the component has to conform to. For each package, normally the pitch spacing, height and general shape is defined. However most packages contain variants with a differing number of leads (for example the classic old-school DIP package comes in 4, 8, and 10 lead variants just to name a few). This means that total land area and size of a package can vary according to how many leads it has.

Standardizing components sizes and shapes makes it easier for the component manufacturer, the PCB manufacturer, and the design engineer. Although most components are standardized, there are still plenty of packages out there. This pages purpose is to hopefully make some sense of the most common and widely used packages and to help anyone choosing a component package or designing a PCB.

Component Package Database

Packages are listed alphabetically above in the contents section.

All land-area (occupied PCB space) calculations are based around the minimum-sized square that encloses the entire package. This does not take into account the size of the pads required on the PCB, which would increase the calculation by a small amount. Nominal package dimensions used for calculation. All 3D models are from http://www.3dcontentcentral.com.

Click on any photo to expand into a full-sized version.

2FF

See SIM Cards.

3FF

See SIM Cards.

4FF

See SIM Cards.

BGA

Name Ball-Grid Array
Synonyms n/a
Variants
  • CABGA
  • CTBGA
  • FBGA
  • DSBGA (Die-Size BGA). Used by Texas Instruments. JEDEC standard MO-207
  • X-DSBGA (Very thin die-size BGA). JEDEC standard MO-211-C.
  • xDSB (Square and rectangular die-size BGA). JEDEC standard MO-207N.
Similar To n/a
Mounting SMD
Pin Count 4-1700+
Pitch 0.5mm, 0.8mm, 1.0mm
Solderability Cannot be soldered with a soldering iron. Requires reflow oven or infrared heater.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models
Common Uses
  • Microcontrollers
  • FPGAs
  • High-density SMD IC’s
  • CPU’s
  • GPU’s
  • Memory

Comments:

The package with the densest pin density out there, BGA’s are used to either make components very small or to encompass a large number of leads. Some modern FPGA’s have more than 1700 leads! Requires an x-ray machine to discover if the balls have correctly soldered onto the pads.

Images:

D2PAK

See TO-263.

D3PAK

See TO-268.

DDPAK

See TO-263.

DPAK

See TO-252.

DIP

Name Dual In-Line Package
Synonyms
  • N Package (Analog Devices)
  • PDIP (plastic dual-inline package)
  • CDIP (ceramic dual-inline package)
Variants
Similar To
Mounting TH
Pin Count 4-64
Pitch 2.54mm (0.1mil)
Solderability Easiest chip package to solder! Perfect for protoyping, fits into standard 100mill pitch prototype board.
Thermal Resistance
Land Area The general land area formula for DIP packages A = ((n/2)*2.54) * (width + 1.65mm) where n is the number of pins and the width is the rated package width in mm (e.g.  7.62 (300mil), 15.24 (600mil)) 
  • DIP-300-8 : 94.2mm2
  • DIP-300-16: 188.4mm2
  • DIP-300-32: 376.7mm2
  • DIP-600-32: 686.4mm2
Height 5.0mm
3D Models DIP-300-8DIP-300-16DIP-300-20DIP-600-40
Common Uses
  • Through-hole IC’s
  • DIP switches
  • Relays/reed switches
  • 7-segment, 4-digit LCD character display footprints (with different package)

Comments:

The most common through-hole IC package. Now mostly superseded by SMT packages. Has standard 100mill pitch spacing. The two rows of legs are usually 300mill (thin-type), or 600mill (fat-type) apart (400mil and 900mil variants are also present). The 600mill package is usually reserved for the larger pin variants. As well as standard through-hole mounting, they can also be inserted into a socket, either by friction or clamping (zero insertion force). Pin numbering is counter-clockwise from the top-left.

Anti-static packaging can easily be made for DIP packages with foam and aluminium foil as shown in the picture below.

making-antistatic-packaging-for-dip-ic-with-aluminium-foil Anti-static packaging can easily be made for DIP packages with foam and aluminium foil.

Components other than ICs can also use this footprint (although they typically have different packages). One example are some 7-segment, 4-digit LCD character displays, which use the DIP-600-12 footprint.

DO-15

See DO-204AC

DO-204AC

Name Diode Outline 204AC
Synonyms DO-15
Variants
Similar To n/a
Mounting TH
Pin Count 2
Pitch 7.62mm (300mil), 10.16mm (400mil), 12.7mm (500mil)
Solderability Easy to solder by hand.
Thermal Resistance n/a
Land Area 38mm2 (with 10.16mm pitch)
Height 6.30mm (max)
3D Models
  • DO-204AC (horizontal, variable pitch, but red!)
  • DO-204AC (horizontal, fixed 12.7mm pitch)
  • DO-204AC (vertical, fixed 2.54mm pitch)
Common Uses

Comments:

A very common axial leaded through-hole package used for diodes. Can be mounted vertically with a 2.54mm pitch to save PCB space (sometimes called the DO-15V package).

Images:

component-package-do-204ac-3d-model A 3D model of the DO-204AC (DO-15) diode component package, with a 10.16mm pitch.

DO-214AA

Name Diode Outline 214AA
Synonyms SMB
Variants n/a
Similar To
Mounting SMD
Pin Count 2
Pitch 3.97mm
Solderability Easy to solder by hand. Don’t use a really fine tip, as the two pins need a fair amount of heat.
Thermal Resistance n/a
Land Area 5.59mm*3.94mm=22.0mm2
Height 2.44mm
3D Models Link
Common Uses
  • Diodes

Comments:

Common package for diodes, and is the in the same family as SMA and SMC. The common name, SMB, is not to be confused with SMD (surface-mount device, the common name for any surface-mount component).

Images:

component-package-do214aa-smb-dimensions-and-land-pattern-gif The dimensions and recommended land pattern for the DO-214AA (SMB) diode component package.
component-package-do214aa-smb-back-and-front-image-jpeg A front and back photo of the DO-214AA (SMB) diode component package.

DO-214AB

Name Diode Outline 214AB
Synonyms SMC
Variants n/a
Similar To
Mounting SMD
Pin Count 2
Pitch 6.8mm
Solderability Easy to solder. The soldering iron needs a bit of juice though, as this package is designed for good heatsinking abilities
Thermal Resistance
  • Tjc = 10-16°C/W
  • Tja = 47-55°C/W (mounted on PCB with 8x8mm copper pad area)
  • Tja = 90°C/W (mounted on PCB with two 1.54×3.14mm copper pads)
Land Area
  • 50.6mm2 (package only)
  • 50.6mm2 (package with recommended land pattern)
Height 2.62mm (when mounted)
3D Models n/a
Common Uses
  • Diodes (especially high surge-current diodes)

Comments:

The largest in the DO-214xx range of diode packages, the DO214AB is a surface-mount package used for diodes that require good heatsinking requirements and/or high-surge current capabilities. Used for general purpose, schottky, and TVS diodes.

Images:

component-package-smc-do-214ab-dimensions-and-land-pattern Dimensions and recommended land pattern for the DO-214AB (SMC) component package. Image from Vishay Outline Dimensions: SMC (http://www.vishay.com/docs/95023/smc.pdf).

DO-214AC

Name Diode Outline 214AC
Synonyms SMA
Variants n/a
Similar To
Mounting SMD
Pin Count 2
Pitch 6.8mm
Solderability Easy to solder by hand.
Thermal Resistance n/a
Land Area n/a
Height 2.62mm (when mounted)
3D Models DO-214AC
Common Uses
  • Diodes

Comments:

Not to be confused with SMD (surface-mount device, the common name for any surface-mount component), or the RF connector type that shares the same name.

Images:

package-do-214ac-recommended-land-pattern The recommended PCB land pattern for the DO-214AC component package.
package-do-214ac-2d-dimensions The dimensions for the DO-214AC component package.

DO-219AA

See SOD-123F.

DO-35

Name Diode Outline 35
Synonyms JEDEC DO-204 Variant AH
Variants n/a
Similar To
  • Other DO-204 variants such as the DO-7, DO-14, DO-15, DO-16, DO-26, DO-29, DO-34, DO-41
Mounting TH
Pin Count 2
Pitch 400mill (user variable)
Solderability Easy to solder by hand.
Thermal Resistance n/a
Land Area n/a
Height 2.28mm (when lying flat on PCB)
3D Models DO-35
Common Uses
  • Diodes (including the popular 1N4148)

Comments:

This a very common package for small-signal low-power through-hole diodes such as the 1N4148.

Images:

OLYMPUS DIGITAL CAMERA OLYMPUS DIGITAL CAMERA

DO-41

Name Diode Outline 41
Synonyms JEDEC DO-204 Variant AH
Variants n/a
Similar To
Mounting TH
Pin Count 2
Pitch 400mill (user variable)
Solderability Easy to solder by hand.
Thermal Resistance 100^{\circ}{\rm C/W}
Land Area
  • 22mm2 (lying flat on PCB, with room to bend legs into holes)
Height 2.00-2.72mm
3D Models DO-35
Common Uses
  • Diodes

Comments:

The most common through-hole package for diodes. The common (1N400x) series of diodes comes in this package. The typical rated current for a diode in this package is 1A. This package is normally mounted on the PCB in two ways, either flat with the legs bent at 90° to fit into the holes, or in space-constrained applications, vertical, with one of the legs straight and one bent 180° to fit into the holes in the PCB (which are closer together than when in the flat orientation. Material of package is normally molded plastic.

DPACK

See TO-252.

E-Line

Name E-Line
Synonyms n/a
Variants n/a
Similar To
Mounting TH
Pin Count 2, 3
Pitch Multiples of 2.54mm (100mill)
Solderability Easy to solder by hand.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models E-Line
Common Uses

Comments:

Very similar to the common TO-92 package, except it is a little flatter (e.g. squashed looking). The TO-92′s back is semi-circular, while the E-Lines is flat with rounded corners (see the outline and dimensions below). It is footprint compatible with the TO-92 package.

Images:

component-package-e-line-outline-and-dimensions The dimensions for the E-line component package. Image from http://www.diodes.com/zetex/_pdfs/3.0/pack/E-Line.pdf.

EEP

Name EEP
Synonyms R-PDSS-T5, R-PDSS-T6
Variants n/a
Similar To n/a
Mounting TH
Pin Count 4-6
Pitch Multiples of 2.54mm (100mill)
Solderability Easy to solder by hand.
Thermal Resistance n/a (it’s a module)
Land Area n/a
Height n/a
3D Models E-Line
Common Uses
  • DC/DC converters

Comments:

Used by Texas Instruments for some of their higher power DC/DC converters. Has a varying number of pins depending on functionality (but this does not change the footprint).

Images:

eep-photo Photo of a DC/DC converter by Texas Instruments in an EEP package.
eep-dimensions Dimensions of the EEP package.

EIA xxxx

Name EIA xxxx
Synonyms 0603, 0805, 1206 e.t.c
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch Variable
Solderability Depends on size
Thermal Resistance Variable
Land Area Variable
Height Variable
3D Models n/a
Common Uses

Comments:

Standard size range for SMD chip components. See the Chip Packages section on this page for more information.

Images:

package-eia-2220 The dimensions for the EIA-2220 component package.

Embedded-SIM

See SIM Cards.

FF

See SIM Cards.

HC-49/U-S

Name HC-49/U-S
Synonyms HC49/US, HC-49US, HC49-US
Variants There a four variants for different height sizes (but same PCB pand pattern).
Similar To HC-49/S (though-hole version)
Mounting SMD
Pin Count 2
Pitch 9.5mm
Solderability Easy to solder, as the leads extrude beyond the edge of the package.
Thermal Resistance n/a (this package is used for low power crytals, not normally relevant)
Land Area 57.8mm2 (12.3×4.7mm)
Height
  • A
  • B
  • C
  • D
3D Models HC49/US 
Common Uses

Comments:

Common footprint for larger SMD crystals. Internal circuitry is shielded by metal case. Comes in 4 height variants (A, B, C and D). The power consumption of crystals in these package usually ranges from 1nW to 1mW, with a typical value being 50uW.

Images:

hc49us-component-package-dimensions-land-pattern The dimensions and recommended land pattern for the HC-49/U-S component package.
hc49us-component-package-photo HC-49/US

LFCSP

See QFN

LGA

Name Land Grid Array
Synonyms n/a
Variants
  • LGA 771 – Intel Socket J
  • LGA 775 – Intel Socket T
  • LGA 1150 – Intel Socket H3
  • LGA 1155 – Intel Socket H2
  • LGA 1156 – Intel Socket H
  • LGA 1207 – AMD Socket F, AMD Socket C32
  • LGA 1356 – Intel Socket B2
  • LGA 1366 – Intel Socket B
  • LGA 1944 – AMD Socket G34
  • LGA 2011 – Intel Socket R
Similar To
Mounting SMD
Pin Count Approx 5-2000.
Pitch Variable
Solderability Cannot solder with a soldering iron, soldering with hot air or infrared is o.k., recommended practise is to use reflow techniques.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses

Comments:

The LGA package comes in many different variants, all which have a different number of pins and a different pin configuration. The pins are normally lines up in a grid of x columns and y rows, but not every position may have a pad. Therefore you can get variants with the same LGA package width and length.

Like BGA’s, LGA packages can withstand up to 50% mis-alignment when soldering, as the package will automatically align itself. LGA packages can be connected to the PCB either with a socket or direct soldering. Intel has popularised the package by using it on some of it’s CPU families.

Images:

MELF

Name Metal Electrode Leadless Face
Synonyms n/a
Variants n/a
Similar To SOD-80, Mini-MELF, Micro-MELF
Mounting SMD
Pin Count 2
Pitch Variable
Solderability Easy to solder by hand, but doesn’t stay in one place!
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • Resistors
  • Diodes

Comments:

Cylindrical shaped components. Not very popular because they have a tendency to roll around when soldering.

Micro SOP

See MSOP.

Micro-MELF

Name Micro Metal Electrode Leadless Face
Synonyms n/a
Variants n/a
Similar To MELF, Mini-MELF, SOD-80
Mounting SMD
Pin Count 2
Pitch 1.70mm
Solderability You can solder these by hand, as long as you’ve had some experience soldering before. The ones with squarish middles are easier!
Thermal Resistance n/a
Power Rating 0.2W
Land Area 3.51mm2
Height 1.10mm
3D Models n/a
Common Uses
  • Resistors
  • Diodes

Comments:

Some versions have squared bits in the middle, making it easier to place one on a PCB and solder without it rolling around. 0Ω resistors in this package usually have a single centered black line.

Images:

component-package-micro-melf-dimensions-and-land-pattern-png The dimensions and recommended land pattern for the Micro-MELF component package. Image from http://www.vishay.com/docs/20003/smm0102.pdf.

Micro3

See SOT-23

Micro-SIM

See SIM Cards.

Mini-DIP SPM

Name Mini Dual In-Line Package
Synonyms SPM27-JA, SPM27-CC, SPM27-EC
Variants n/a
Similar To DIP
Mounting TH
Pin Count 27
Pitch 1.778mm, 2.050mm, 2.531mm (3 different pitches on the one package!)
Solderability Easy to solder by hand.
Thermal Resistance n/a
Land Area Mini-DIP SPM 27 : 44mm x 26.8mm = 1179.2mm^2
Height 3.15mm (when mounted)
3D Models n/a
Common Uses
  • BLDC motor drivers from Fairchild

Comments:

The SPM27-JA does not have a top-side copper face, while the SPM27-CC and SPM27-EC do. The copper face has been designed specifically for heatsinking as these IC’s are designed to be able to handle plenty of power. This package is rather unique in the fact it contains a three-phase IGBT inverter circuit power block and four drive IC’s. As of 2012, only a 27-pin variant exists.

Images:

package-mini-dip-spm27-picture-and-package-cross-section Picture and package cross-section of the Mini-DIP SPM27 from Fairchild.

Mini-MELF

See SOD-80 or SOD-87

Mini-SIM

See SIM Cards.

MSE

See MSOP

MSOP

Name Micro Small Outline Package
Synonyms
  • Micro SOP
  • RM-8, RM-10 (Analog Devices, no pad)
  • MINI_SO_EP, RH-8-1, RH-10-1 (Analog Devices, with pad)
  • MSE (Linear Technology)
  • uSOP (Maxim Integrated)
  • uMAX (Maxim Integrated)
  • u8+1 (Maxim Integrated package code for MSOP-8 P0.65mm)
Variants n/a
Similar To SSOP
Mounting SMD
Lead-type Gull-wing
Pin Count 8-16
Pitch 0.50mm (MSOP-16), 0.65mm (uMAX, uSOP)
Solderability Moderately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques.
Thermal Resistance n/a
Dimensions 4.9×3.0×1.1mm (LA: 14.7mm2)
Height 1.10mm
3D Models
Common Uses
  • Audio amplifiers (Analog Devices)
  • LED Controllers (Linear Technology)

Comments:

The width of any MSOP package is always 3mm. The length is also commonly 3mm (except for MSOP-16). To allow for this, the pitch usually decreases as the pin count increases. The exposed pad on this package is optional (Analog Devices have separate codes for each).

Images:

Nano-SIM

See SIM Cards.

PDMU

See SOD-123F.

PP3

See Battery Sizes.

PP9

See Battery Sizes.

QFN

Name Quad-flat No-leads Package
Synonyms
  • DO-214AC
  • LFCSP (Analog Devices)
  • RQZ (QFN-48, 7x7mm, 050mm pitch by Texas Instruments)
  • RSB (QFN-40 by Texas Instruments)
  • QFN-UT (Ultra-thin QFN packages by Samtech)
  • 2077-02 (Freescale QFN-16 Pins-5×3 Body-3x3mm)
  • CP-32-2 (Analog Devices QFN-32 Pins-8×8 Pitch-0.50mm Body-5x5mm)
Variants n/a
Similar To UQFNVQFN
Mounting SMD
Pin Count 12-108
Pitch 0.40mm, 0.50mm, 0.65mm
Solderability Surprisingly easy to solder by hand, as long as the pads extend around to the sides of the IC, and you drill a hole to solder the centre pad from the reverse. QFN packages can also be soldered easily with a infrared rework station or the ‘frying pan’ technique.
Thermal Resistance n/a
Dimensions 0.40mm pitch QFN packages:
  • QFN-UT-20: 3x3x0.6mm (LA: 9mm2)
  • QFN-56: 7x7x1mm (LA: 49mm2)
  • QFN-64: 8x8x1mm (LA: 64mm2)
  • QFN-72: 9x9x1mm (LA: 81mm2)
  • QFN-88: 10x10x1mm (LA: 100mm2)
  • QFN-108: 12x12x1mm (LA: 144mm2)
0.50mm pitch QFN packages:
  • QFN-16: 3x3x1mm (LA: 9mm2)
  • QFN-20: 3x3x1mm (LA: 9mm2)
  • QFN-24: 4x4x1mm (LA: 16mm2)
  • QFN-32: 5x5x1mm (LA: 25mm2)
  • QFN-36: 6x6x1mm (LA: 36mm2)
  • QFN-48: 7x7x1mm (LA: 49mm2)
  • QFN-56: 8x8x1mm (LA: 64mm2)
  • QFN-64: 9x9x1mm (LA: 81mm2)
  • QFN-68: 10x10x1mm (LA: 100mm2)
0.65mm pitch QFN packages:
  • QFN-16: 4x4x1mm (LA: 16mm2)
  • QFN-20: 4x4x1mm (LA: 16mm2)
  • QFN-32: 7x7x1mm (LA: 49mm2)
Height 1mm (max, applies to all QFN packages, includes stand-off). Some a smaller (e.g. the UT/ultra-thin QFN packages).
3D Models 0.50mm Pitch:  0.65mm Pitch:
Common Uses
  • Microcontrollers
  • High-pin count, low footprint IC’s

Comments:

Commonly used today for higher pin-count IC’s such as microcontrollers. On of the highest pin-density SMD packages without resorting to BGA. Note that there are different pitch footprints within the QFN family! And QFN packages do not have to be square, some rectangular versions exist with a different number of leads on the two sides.

QFN packages offer benefits over other packages for high-speed circuits, as well as high heat dissipation capabilities. QFN packages are lacking gull-wing leads (like that present on the QFP package), which create noise in high-speed applications.

Texas Instruments recommends rounded pads on the QFN package to prevent solder bridging. Also, stencil windows are recommended for the solder paste on the thermal pad so that a limited amount of solder is added. Too much solder can cause the QFN package to “float” around during the soldering process.

Images:

QIP

Name Quad Inline Package
Synonyms
  • QIL
Variants n/a
Similar To
Mounting TH
Pin Count 4-24
Pitch 2.54mm (100mill)
Solderability Very easy to solder by hand.
Thermal Resistance n/a
Dimensions n/a
3D Models n/a
Common Uses n/a

Comments:

Has four rows of pins. Used in the 1970′s when single-sided boards with through-hole components was common. Allowed tracks to be run between pins.

RM

See MSOP.

SC-104A

See SOD-723.

SC-108A

See SMini2-F4-B-B.

SC-109B

See Mini2-F3-B.

SC-109D

See SOD-123.

SC-110A

See TMiniP2-F2-B.

SC-116A

See SOD-923.

SC-59

See SOT-23-3.

SC-70

See SOT-323

SC-74A

See SOT-23-5.

SC-79

See SOD-523.

SC-90A

See SMini2-F5-B.

SIP

Name Single Inline Package
Synonyms n/a
Variants n/a
Similar To
Mounting TH
Pin Count 4-24
Pitch 2.54mm (100mill)
Solderability Very easy to solder by hand.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses n/a

Comments:

Commonly used for resistor networks and RAM chips. Similar to the DIP package except there are only one row of pins.

SMA

See DO-214AC.

SMB

See DO-214AA.

SMC

See DO-214AB.

SMD-220

See TO-263.

SMD35

Name SMD35
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch n/a
Solderability You can solder this by hand, due to the pins running up the side of the package for a short distance.
Thermal Resistance 200mW is the maximum power this package can dissipate before you have to consider special PCB footprint designs.
Dimensions
  • WxLxH = 3.50×3.50×0.80mm
  • Land Area = 12.25mm2 (3.50×3.50mm)
3D Models n/a
Common Uses

Comments:

Used exclusively by Seti for their range of Deep UV LEDs.

Images:

SMini3-G1-B

See SOT-323.

SNAPHAT

Name SNAPHAT
Synonyms n/a
Variants n/a
Similar To n/a
Mounting TH
Pin Count 28, 44
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • Back-up powered time keeping on pcb’s

Comments:

Package registered by ST Microelectronics. Used to hold small rechargeable batteries and crystals for timekeeping on circuit boards once the power is removed. The top part containing the batteries and crystal can ‘snap’ into package after reflow, to avoid damaging the battery.

Images:

component-package-snaphat-dimensions The dimensions for the SnapHat component package.
component-package-snaphat-schematic The schematic for the SnapHat component package.

SO

See SOIC.

SOD-110

Name Small-outline diode 110
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch n/a
Solderability Easily solderable by hand.
Thermal Resistance n/a
Dimensions n/a
3D Models n/a
Common Uses
  • Diodes

Comments:

n/a

Images:

component-package-sod-110-2d-outline-with-dimensions The dimensions of the SOD-110 component package. Image from NXP SOD-110 Package Outline (http://www.nxp.com/documents/outline_drawing/sod110_po.pdf)

SOD-123F

Name SOD-123F (Small-outline diode 123F)
Synonyms
  • DO-219AA
  • PDMU (Rohm)
  • M1F (Fagor Electronica)
Variants n/a
Similar To
  • SOD-123W
Mounting SMD
Pin Count 2
Pitch 2.8mm
Solderability Easily solderable by hand.
Thermal Resistance n/a
Dimensions
  • Recommended Footprint = 4.4×2.1mm = 9.2mm2
3D Models n/a
Common Uses
  • Diodes

Comments:

The SOD-123F component package has narrow, flat leads protruding from the base of the SMD package.

Images:

SOD-128

Name Small-outline diode 128
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch 4.4mm
Solderability Easy to hand solder with a little experience
Thermal Resistance
  • R_{JA} = 200^{\circ}{\rm C}/W (standard land pattern, see below)
  • R_{JA} = 120^{\circ}{\rm C}/W (mounting pad for cathode 1cm²)
  • R_{JA} = 60^{\circ}{\rm C}/W (mounted on ceramic PCB with standard footprint)
Land Area n/a
Height 1.1mm (mounted on PCB)
3D Models n/a
Common Uses
  • Standard diodes
  • TVS diodes

Comments:

A package used by NXP for some of their diodes.

Images:

sod128-recommended-land-pattern The recommended land pattern for the SOD-128 component package.
sod128-3d-model The 3D model for the SOD-128 component package.
sod128-package-outline The package outline for the SOD-128 component package.

SOD-323

Name Small-outline Diode 323
Synonyms SC-76
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch n/a
Solderability Easy to hand solder,
Thermal Resistance n/a
Land Area n/a
Height 1.1mm (mounted on PCB)
3D Models n/a
Common Uses
  • Diodes

Comments:

n/a

SOD-723

Name Small-outline Diode 723
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch 1.1mm
Solderability n/a
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • Standard diodes
  • TVS diodes

Comments:

n/a

Images:

package-sod-723-recommended-land-pattern The recommended PCB land pattern for the SOD-723 component package.
package-sod-723-2d-dimensions 2D dimensions drawing of the SOD-723 package. Taken from the NXP SOD-723 datasheet (http://www.nxp.com/documents/outline_drawing/sod723_po.pdf).

SOD-80

Name Small-outline Diode 80
Synonyms Mini-MELF, DO213-AA
Variants n/a
Similar To MELF
Mounting SMD
Pin Count 2
Pitch n/a
Solderability Easy to solder by hand, but doesn’t stay in one place!
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • Diodes

Comments:

Cylindrical shaped components. Not very popular because they have a tendency to roll around when soldering.

Images:

component-package-sod-80-dimensions-and-land-pattern Image from http://www.topline.tv/drawings/images/MELF_Diodes/SOD80.gif.

SOD-87

Name Small-outline Diode 87
Synonyms Mini-MELF
Variants n/a
Similar To MELF
Mounting SMD
Pin Count 2
Pitch n/a
Solderability Easy to solder by hand, but doesn’t stay in one place!
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • Diodes

Comments:

Cylindrical shaped components. Not very popular because they have a tendency to roll around when soldering.

Images:

n/a

SOIC

Name Small Outline Integrated Package
Synonyms
  • SO (ST Microelectronics)
  • S8 (SOIC-8, Analog Devices)
  • S8E (Linear Technologies, SOIC-8 with exposed pad)
  • WSON (SST, this is a package which shares the same footprint as a SOIC but has a smaller height, not to be confused with the different SON package)
Variants SOIC-x, where x is the number of pins.
Relevant Standards
  • JEDEC MS-012-AA (SOIC Narrow)
  • JEDEC MS-013 (SOIC Wide)
Similar To SOJ
Mounting SMD
Pin Count 8, 14, 16, 18, 20, 24, 28, 32
Pitch 1.27mm (50mill)
Solderability Relatively easy to hand solder compared to other SMT packages.
Thermal Resistance
  • SOIC-8: 70.6K/W (pads only, no copper fill)
  • SOIC-8: 55K/W (6cm2 of copper, ground pins attached internally to die)
  • SOIC-8: 33.5K/W (1 square inch of copper surrounding package, connected to ground)
Land Area
  • SOIC-8: 29.4mm2
Height 1.50-2.54mm
3D Models n/a
Common Uses
  • Linear regulators
  • Drivers/buffers

Comments:

SOIC packages have a fixed pitch of 1.27mm (50mill) and usually have Gullwing leads. When used for regulators, sometimes the many ground pins are connected internally to the die attach flag, providing better heat sinking capabilities. SOIC packages use leadframe technology.

Pin numbering is the same as a DIP package, in that pin 1 is at the top left, and then pins are numbered sequentially down the left-hand side, the up the right hand-side.

There are three ways of indicating the polarity on a SOIC package. The first two, a dot or a notch, indicate pin 1 or the top of the chip. The third way is not so obvious, and features a bevelled edge along the side that pin 1 is on (so for SOIC-8, the bevelled edge would be on the side with pins 1 to 4).

The WSON package by SST is lower in height than a standard SOIC package, but is designed to use the same PCB footprint.

Images:

SOJ

Name Small-outline J-leaded Package
Synonyms SOIJC (Small-outline IC J-leaded Package)
Variants Varying number of pins.
Similar To SOIC
Mounting SMD
Pin Count 4-40
Pitch
  • SOJ-4: 5.50mm
  • Everything else: 1.27mm
Solderability Easy to solder by hand, infrared and reflow techniques.
Thermal Resistance n/a
Land Area n/a
Height
  • SOJ-4: 2.5mm
3D Models
Common Uses
  • Crystal oscillators

Comments:

Same general package dimensions as the standard SOIC but with J-type leads rather than Gull-wing leads. Commonly used for crystal oscillators.

Images:

ic-package-soj-28-photo Photo of a SOJ-28 package, a variant of the SOIC package with J-type leads.

SON

Name SON (Small-outline No-lead Package)
Synonyms
  • DSG (TI)
  • PE-SON-8 (SON-8, Ricoh)
  • SW-PWSON-N8 (SON-8, TI)
  • WDFN-6 (SON-6, On Semiconductor/Fairchild Semiconductor)
Variants Varying number of pins.
Similar To
Mounting SMD
Pin Count 6, 8 (all also have exposed thermal pad)
Pitch 0.5mm
Solderability Hard/impossible to solder with a soldering iron due to underside thermal pad and tiny pitch.
Thermal Resistance

SON-8:

 
  • Tja = 333°C/W (free-air)
  • Tja = 65.3°C/W (mounted on PCB with standard land pattern)
  • Tjc (bottom) = 12.8°C/W (thermal resistance between junction and the thermal pad)
Dimensions

SON-8

  • Package: 2.0×2.0×0.75mm (w*l*h)
  • Recommended Land Pattern: 2.4×1.92mm (4.61mm2)
3D Models  DSG (S-PWSON-N8)
Common Uses

Comments:

The SON package has a exposed thermal pad on the underside, similar to a QFN package.

Images:

SOP-4

Name Small-outline Package
Synonyms n/a
Variants n/a
Similar To SOP-4L (which is longer)
Mounting SMD
Pin Count 4
Pitch 2.54mm (width), 6.35mm (length)
Solderability Easy to solder by hand.
Thermal Resistance n/a
Power Dissapation 170mW (no heatsink)
Land Area 28.7mm2 (7×4.1mm)
Height 2.0mm (max)
3D Models SOP-4
Common Uses Solid-state relays, optocouplers.

Comments:

An easy to solder, medium sized, 4-pin SMD package. Commonly used for small solid-state relays (Vishay makes quite a few of them). Related to SOP-4L, which is the same width, but longer.

Images:

sop-4-component-package-dimensions-and-land-pattern The dimensions and recommended land pattern for the SOP-4 component package. Image from http://www.everlight.com/datasheets/EL452-G.pdf.
sop-4-component-package-3d-model A 3D model of the SOP-4 component package. Image from www.digikey.com.

SOT-1040-1

Name “Small Outline Transistor 1040-1″ or “Plastic Flip Chip Strap Package
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses NXP RFID inlays

Comments:

Exclusively used by NXP for some of their RFID inlays. I’m not sure why they labelled it as a “SOT” package, as it is very different from everything else in this range.

Images:

component-package-sot-1040-1-outline-drawing The dimensions of the SOT-1040-1 component package. Image from http://www.nxp.com/packages/SOT1040-1.html.
component-package-sot-1040-1-3d-model The 3D model of the SOT-1040-1 component package. Image from http://www.nxp.com/documents/outline_3d/sot1040-1_3d.gif.

SOT-1193

Name Small Outline Transistor 1193
Synonyms n/a
Variants SOT-1193-1 (XQFN8), SOT1193-2 (XQFN8)
Similar To SOT-902
Mounting SMD
Pin Count ?
Pitch n/a
Solderability Hard to solder because it is just so small!
Thermal Resistance n/a
Land Area 2.56mm² (1.60×1.60mm)
Height n/a
3D Models n/a
Common Uses NXP RFID chips

Comments:

NXP seems to be the only manufacturer who uses this package.

Images:

component-package-sot-1193-2-nxp-xqfn8-dimensions The dimensions for the SOT-1193-2 component package. Image from http://www.nxp.com/documents/outline_drawing/sot1193-2_po.pdf.

SOT-223

See TO-261AA

SOT-23

Name SOT-23 (Small Outline Transistor 23)
Synonyms
  • Micro3 (SOT-23-3)
  • SC-59 (SOT-23-3 by JEITA)
  • SC-74A (SOT-23-5 by JEITA)
  • SOT-23 (SOT-23-3 by TopLine)
  • SOT-25 (SOT-23-5 by TopLine)
  • SOT-26 (SOT-23-6 by TopLine)
  • SOT-28 (SOT-23-8 by TopLine)
  • SOT-753 (SOT-23-5)
  • SSOT3 (SOT-23-3 by Fairchild Semiconductor)
  • TO-236AA (SOT-23-3 by JEDEC)
  • TO-236AB (by JEDEC)
Variants There are 3-pin (SOT-23-3), 5-pin (SOT-23-5), 6-pin (SOT-23-6) and 8-pin (SOT-23-8) variants.
Similar To n/a
Mounting SMD
Pin Count 3, 5, 6, 8
Pitch 0.95mm
Solderability Easy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or relow techniques.
Thermal Resistance SOT-23-5: 230°C/W
Dimensions The body of all SOT-23-x packages is 1.30×2.92mm.
3D Models n/a
Common Uses

Comments:

A very common surface-mount package that is used for a huge number of functions. Has 3 variations, one with 3 legs, one with 5, and another with 6. The number of pins used not only depends on the required number of connections but also the desired thermal resistance (high-current SOT23 devices may use more than one pin for the same net to improve thermal performance). Used commonly for FET’s transistors, diodes, and other components only having a small number of leads. SparkFun makes a SOT-23 to DIP breakout board.

Images:

package-dimensions-sot23-3 The dimensions of the SOT-23-5 component package.

SOT-25

See the SOT-23-5 variant of SOT-23.

SOT-26

See the SOT-23-6 variant of SOT-23.

SOT-28

See the SOT-23-8 variant of SOT-23.

SOT-323

Name SOT-323 (Small Outline Transistor 323)
Synonyms
  • SC-70 (SOT323-3, JEITA)
  • SCx (Analog Devices)
  • SMini3-G1-B (SOT323-3, Panasonic)
Variants
  • SOT-323-3 (3 lead)
  • SOT-323-5 (5 lead)
  • SOT-323-8 (8 lead)
Similar To SOT-363
Mounting SMD
Pin Count
  • 3 (SOT-323-3)
  • 5 (SOT-323-5)
  • 8 (SOT-323-8, SC8)
Pitch
  • 0.50mm (SOT-323-8, SC8)
  • 0.65mm (all other variants)
Solderability Difficult to solder by hand (but possible).
Thermal Resistance
  • SOT-323-3: Tja = 380°C/W (mounted on 10x8x0.6mm FR4, still air)
  • SOT-323-8: Tja = 70-90°C/W
Land Area 2.10×2.00mm (4.20mm2)
Height 0.95mm
3D Models n/a
Common Uses
  • Diodes (SOT-323-3)
  • Voltage regulators (SOT-323-8)

Comments:

This package is a little confusing because it shares two common names, the SOT-323-x and the SC-70-x. And it also can have a different pitch (the SOT-323-8, aka SC-70-8 or SC8 has a 0.5mm pitch). It has a lead-pitch double that of the SOT-363.

Images:

component-package-sot-323-5-dimensions-and-land-pattern Dimensions and recommended land pattern for the SOT-323-5 (SC-70-5) component package.
component-package-sot-323-3-3d-model 3D model of the SOT-323-3 (SC-70-3) component package.
component-package-sot-323-5-3d-model 3D model of the SOT-323-5 (SC-70-5) component package.

SOT-363

Name Small Outline Transistor 363
Synonyms n/a
Variants n/a
Similar To SOT-323
Mounting SMD
Pin Count 6
Pitch 0.65mm
Solderability Difficult to solder by hand (but possible).
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses n/a

Comments:

SOT-363 is used for smaller SMD transistors and MOSFET’s. It has a lead-pitch half of that of the SOT-323.

SOT-523F

Name Small Outline Transistor 523F
Synonyms SC-89-3
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 3
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses n/a

Comments:

None

SOT-563

Name Small Outline Transistor 563
Synonyms SC-89-6
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 6
Pitch n/a
Solderability Hard to solder because it is just so small!
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses MOSFET’s

Comments:

Tiny 6 leaded SMT package

SOT-753

See SOT-23-5.

SOT-762-1

Name Small Outline Transistor 762-1
Synonyms MO-241 (Jedec)
Variants n/a
Similar To QFN
Mounting SMD
Pin Count 14
Pitch n/a
Solderability Hard to solder because it is just so small!
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses Digital logic (e.g. Flip-flops)

Comments:

A small 14-leaded SMD package with a thermal pad in the middle (similar to some QFN packages).

Images:

SOT-886

Name Small Outline Transistor 886
Synonyms XSON6 (NXP RFID), 6-XFDFN (DigiKey)
Variants n/a
Similar To SOIC
Mounting SMD
Pin Count 6
Pitch n/a
Solderability Very hard to solder by hand.
Thermal Resistance n/a
Land Area 1.45mm² (1.45x1mm)
Height 0.5mm
3D Models n/a
Common Uses
  • RFID tag chips (e.g. the some of the NXP UCODE G2il chips)
  • Logic gates
  • Buffers/line drivers
  • Linear voltage regulators

Comments:

NXP seems to be the only manufacturer who uses this package.

Images:

component-footprint-sot-886-land-pattern The PCB land pattern for the SOT-886 component package. Image from http://www.nxp.com/documents/reflow_soldering/sot886_fr.pdf.

SOT-902

Name Small Outline Transistor 902
Synonyms XQFN8U (NXP RFID)
Variants SOT-902-1 (XQFN8U), SOT-902-2 (XQFN8), SOT-902-3 (XQFN8)
Similar To SOT-1193SOIC
Mounting SMD
Pin Count 8
Pitch ?
Solderability Very hard to solder by hand.
Thermal Resistance ?
Land Area 2.56mm (1.6×1.6mm)
Height 0.5mm²
3D Models ?
Common Uses RFID tag chips (e.g. the some of the NXP UCODE G2il chips)

Comments:

NXP seems to be the only manufacturer who uses this package.

Images:

component-package-sot-902-3-nxp-xqfn8-dimensions The dimensions for the SOT-902-3 component package. Image from http://www.nxp.com/documents/outline_drawing/sot902-3_po.pdf.
component-package-sot-902-3-nxp-xqfn8-land-pattern The land pattern for the SOT-902-3 component package. Image from http://www.nxp.com/documents/reflow_soldering/sot902-3_fr.pdf.

SOT-923

Name Small Outline Transistor 923
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 2
Pitch n/a
Solderability Hard to solder because it is just so small!
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses TVS Diodes

Comments:

Tiny package used for diodes! See the below picture for a comparison of one of these packages next to a USB socket.

Images:

tiny-sod-923-package-relative-to-usb-conn 3D model showing the difference between the size of a tiny SOD-923 package and a PCB-mount USB connector.

SPM23

Name Smart Power Module
Synonyms n/a
Variants n/a
Similar To Mini-DIP SPM
Mounting SMD
Pin Count 23
Pitch n/a
Solderability Easy to solder by hand, infrared or reflow techniques.
Thermal Resistance n/a
Land Area n/a
Height 3.1mm
3D Models n/a
Common Uses
  • Motor drivers
  • Inverters

Comments:

Package proprietary to Fairchild Semiconductor, used for some of their motor driver IC’s. Similar to a through-hole version called the Mini-DIP SPM. The package is designed to have a large flat top surface for heat sinking.

Images:

component-package-spm-23-land-pattern The land pattern for the SPM-23 component package.

TO-205AD

See TO-39.

TO-220AB

Name Transistor Outline 220AB
Synonyms n/a
Variants TO-220AC, TO-220F
Similar To n/a
Mounting TH
Pin Count 3
Pitch 2.54mm (100mil)
Solderability Easily soldered by hand
Thermal Resistance
  • T_{JC} = 3^{\circ}{\rm C}/W
  • T_{JA} = 34^{\circ}{\rm C}/W
Land Area 44mm^2
Height 18.8mm high when mounted vertically, with pins pushed into PCB until they hit the taper.
3D Models n/a
Common Uses MOSFET’s

Comments:

A variant on the TO-220 package with three leads and the pad (but only has three distinct connections). Commonly used in power electronics for components which require high heat-dissipation. Can dissipate about 1W of power without a heatsink.

Images:

component-package-to-220ab-dimensions The dimensions of the TO-220AB component package.

component-package-to-220ab-photo A photo of the TO-220AB component package.
component-package-to-220ab-mounted-on-heatsink A photo of the TO-220AB component package, mounted on a heatsink.

TO-220AC

Name Transistor Outline 220AC
Synonyms n/a
Variants
Similar To n/a
Mounting TH
Pin Count 2
Pitch n/a
Solderability Easily soldered by hand, but tab requires a fair amount of ooomf to solder.
Thermal Resistance
  • T_{JC} = 3^{\circ}{\rm C}/W
  • T_{JA} = 34^{\circ}{\rm C}/W
Land Area n/a
Height n/a
3D Models n/a
Common Uses MOSFET’s

Comments:

A variant on the TO-220 package with only two leads and the pad (which still means it could have three distinct connections). Use for some high power diodes.

Images:

to-220ac-photo A photo of the TO-220AC component package.
to-220ac-dimensions The dimensions of the TO-220AC component package.

TO-220F

Name Transistor Outline 220F
Synonyms n/a
Variants TO-220ABTO-220AC
Similar To n/a
Mounting TH
Pin Count 2
Pitch n/a
Solderability Easily soldered by hand, but tab requires a fair amount of ooomf to solder.
Thermal Resistance
  • T_{JC} = 3^{\circ}{\rm C}/W
  • T_{JA} = 34^{\circ}{\rm C}/W
Land Area n/a
Height n/a
3D Models n/a
Common Uses MOSFET’s

Comments:

A variant on the TO-220 package which has an insulated body.

Images:

component-package-to-220f-dimensions The dimensions for the TO-220F component package. Image from http://semicon.njr.co.jp/eng/icpackage/TO-220F-3_E.html.
component-packages-to-220f-photo A photo of the TO-220F component package.

TO-226

Name TO-226 (JEDEC Transistor Outline 226)
Synonyms n/a
Variants n/a
Similar To TO-92
Mounting TH
Pin Count 3
Pitch n/a
Solderability Easily soldered by hand.
Thermal Resistance n/a
Land Area n/a
Height 10mm (typical, including body and enough space to get the through-hole legs mounted in the PCB).
3D Models n/a
Common Uses
  • Transistors
  • Thyristors

Comments:

The TO-226 is a small through-hole package used for transistors, thyristors, and other semi-conductors. It is similar to the very common TO-92 package, except it has an elongated body. Like the TO-92, it’s legs can be bent, usually to give it a pitch of 2.54mm.

TO-252

Name TO-252 (JEDEC Transistor Outline 252)
Synonyms
  • DPAK (TO-252-3)
  • TO-252AA (TO-252-3)
  • Case 369C (On Semiconductor’s name for the TO-252AA)
Variants
  • TO-252-3 (also called TO-252AA or DPAK)
  • TO-252-5-P1 (5-pin, square and short tab)
  • TO-252-5-P2 (5-pin, rounded and longer tab). If there is no suffix listed, it will likely be this variant.
Similar To TO-220AB
Mounting SMD
Pin Count 3 (standard), 5 (TO-252-5)
Pitch 1.27mm (50mill)
Solderability Quite easy to hand-solder, although the large tab can make things difficult because of it’s heatsinking capabilities.
Thermal Resistance

TO-252-3 (DPAK)

  • T_{JA} = 80^{\circ}{\rm C}/W (pads only, no copper fill)

TO-252-5-xx (both P1 and P2 suffixes)

  • T_{JA} = 59^{\circ}{\rm C}/W (pads only, no copper fill)
  • T_{JA} = 26^{\circ}{\rm C}/W (high-wattage land pattern)
  • T_{JA} = 20^{\circ}{\rm C}/W (one square inch of copper surrounding package, connected to ground)
  • T_{JA} = 7^{\circ}{\rm C}/W (high-wattage land pattern with thermal vias to bottom layer)
Dimensions n/a
3D Models n/a
Common Uses
  • MOSFET’s
  • Linear voltage regulators

Comments:

Commonly used for power MOSFET’s and high power voltage regulators. Features a large tab/pin which can be soldered directly onto the PCB, providing good heatsinking capabilities.

Images:

component-package-to-252-5-recommended-land-pattern The recommended PCB land pattern for the TO-252-5 component package. Image from Ricoh TO-252 Package Information (http://www.ricoh.com/LSI/product_power/pkg/to-252-5-p2.pdf).
to-252-3d-model 3D model of the TO-252 (DPACK) package.

TO-261AA

Name Transistor Outline 261AA
Synonyms
  • MP04A (National Semiconductor)
  • TO-261-4
  • SOT-223 (common)
  • PG-SOT-223-4 (Infineon Technologies)
  • ST Package (Analog Devices)
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 4 (including tab)
Pitch n/a
Solderability Easily solderable by hand
Thermal Resistance
  • T_{JA} = 174^{\circ}{\rm C}/W (standard footprint)
  • T_{JA} = 75^{\circ}{\rm C}/W (300mm^2 heatsink area)
  • T_{JA} = 63^{\circ}{\rm C}/W (600mm^2 heatsink area)
  • T_{JA} = 27^{\circ}{\rm C}/W(one square inch copper fill surrounding package)
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • MOSFET’s
  • High-power linear regulators

Comments:

package-sot223-thermal-resistance The thermal resistance of the SOT-223 package.

TO-263

Name Transistor Outline 263
Synonyms
  • D2PAK
  • DDPAK
  • TO-263AB (TO-263-3S only)
  • TO-279 (TO-263 THIN only)
  • SMD-220 (because the TO-263 is the SMD equivalent of the TO-220).
Variants
  • TO-263-X1X2where X1 is the lead count and X2 is the length of the centre pin.
  • TO-263 THIN (a thinner component which shares the same footprint by Texas Instruments)
Similar To TO-220AB
Mounting SMD
Pin Count 3, 5, 7, or 9 (this is X1). All packages also have a thermal pad.
Pitch
  • TO-263-3, TO-263-3S: 2.54mm
  • TO-263-7, TO-263-7S: 1.7mm
Solderability Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance

TO-263-3

  • T_{JA} = 18.0^{\circ}{\rm C}/W (1 square inch of copper surrounding pads, connected to ground)
  • T_{JA} = 33.6^{\circ}{\rm C}/W (copper filling package land-area)
  • T_{JA} = 36.7^{\circ}{\rm C}/W (pads only, no copper fill)

TO-263-5L THIN

  • T_{JA} = 22.0^{\circ}{\rm C}/W (no air flow, on JEDEX 4-layer test board)
Land Area n/a
Height
  • All except TO-263 THIN: 4.57mm
  • TO-263 THIN: 2.00mm
3D Models
Common Uses
  • High power MOSFET’s
  • High power LDO’s

Comments:

This package can be considered the SMT version of the TO-220AB. It is a 3, 5 or 7 leaded heavy-duty package that allows for good heat-sinking due to a large pad on it’s underside. Used frequently for high power MOSFETs. Comes with either a normal middle lead (X2 = nothing) or a short, cut-off middle lead (X2 = S).

The synonym for the TO-263 package, D2PAK, stands for “double decawatt package”. It was designed by Motorola for high power devices.

Images:

TO-268

Name Transistor Outline 268
Synonyms
  • D3PAK
  • DDDPAK
  • Decawatt Package 3
  • TO-268AA (TO-268-3)
Variants n/a
Similar To
Mounting SMD
Pin Count 3
Pitch 5.461mm
Solderability Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance
  • T_{JC}: 0.24-1.18^{\circ}{\rm C}/W
  • T_{JA}: 40^{\circ}{\rm C}/W
  • T_{JA}: 21.9^{\circ}{\rm C}/W (13.5×17.5mm copper pad)
  • T_{JA}: 18^{\circ}{\rm C}/W (19×29.4mm copper pad)
Land Area n/a
Height 5.03mm
Weight 6.2g
3D Models TO-268AA (D3PAK)
Common Uses
  • Microsemi power MOSFET’s
  • Microsemi power diodes
  • Microsemi power IGBT’s

Comments:

The TO-268 (D3PAK) package is bigger than the TO-263 (D2PAK) package. The D3PAK name stands for “decawatt 3 package”. Unlike the TO-263 package, the TO-268 package only comes in one variant with 3 pins.

It is designed to have a really low thermal resistance so that it can be used in high power applications. The larger die also means that MOSFETs in this package can have lower R_{DS(ON)} values, resulting in less power dissipation for the same current.

I have only ever seen this in the 3-pin variant (called TO-268-3).

Images:

TO-279

See TO-263.

TO-277A

Name (JEDEC) Transistor Outline 277A
Synonyms
  • SMPC (Vishay)
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 3 (2 pins + 1 pad)
Pitch
    2.13mm (between pins 1 and 2, excluding the pad (pin 3))
Solderability A little tricky to solder by hand, as this package has a pad. However, since the pad comes right to the edge, it can be done with a large and hot enough soldering iron tip. Easy to solder with with infrared or reflow techniques.
Thermal Resistance
  • T_{JC} = 3^{\circ}{\rm C}/W
  • T_{JA} = 60^{\circ}{\rm C}/W (recommended land pattern, no thermal vias)
Physical Dimensions
  • Package Size: 4.60×6.50×1.10mm (width*length*height)
  • Recommended Footprint Land Area: 4.8×6.8mm = 32.6mm2
3D Models
Common Uses
  • Medium/high power diodes.

Comments:

Used by Vishay and Bruckewell.

Images:

TO-3

Name Transistor Outline 3
Synonyms
  • TO-204AD (TO-3-2L)
Variants
  • TO-3-2L (2 pins + case)
  • TO-3-4L (4 pins + case)
  • TO-204 AA (TO-3-2L with 1.0mm pins)
  • TO-204 AE (TO-3-2L with 1.5mm pins)
  • TO-204 AD
Similar To TO-23
Mounting TH
Pin Count 3, 5, 8 (including the case)
Pitch 10.9mm (0.430″) (TO-3-2L)
Solderability Easy to solder by hand.
Thermal Resistance
  • T_{JC} = 0.83-1.4^{\circ}{\rm C}/W (depending on exact component)
  • T_{CH} = 0.40^{\circ}{\rm C}/W (using thermal grease)
  • T_{CH} = 1.00^{\circ}{\rm C}/W (using thermal grease with mica insulator)
  • T_{JA} = 30.0^{\circ}{\rm C}/W (typical socket mount)
Dimensions 39.94x26.67=1065mm^2 (smallest square area to enclose package)
Height

All variants of the TO-3 package seem to have the same height.

6.35-11.43mm (0.250-0.450") (when mounted flat with no standoff on PCB)
3D Models n/a
Common Uses
  • Transistors (TO-3-2L)
  • Linear regulators (TO-3-2L)
  • Op-amps (TO-3-8L)
  • Diodes (TO-3-2L)

Comments:

This package comes in many different pin variants. The 2-pinned device, called the TO-3-2L is the most common.

The TO-3 package has a very low junction-to-case thermal resistance (0.8-1.5^{\circ}{\rm C}/W). The TO-3 package is flange mount, which facilitates easy heatsinking. They are commonly screwed onto the metal enclosure of the device (you can sometimes see them on the outside of the enclosure!) for cheap and effective heatsinking.

Large heatsinks designed for the TO-3 package can have thermal resistances as low as 0.4^{\circ}{\rm C/W}. The thermal resistance between the device case and the heatsink is normally between 0.5-1.7^{\circ}{\rm C/W}.

Images:

TO-39

Name Transistor Outline 39
Synonyms
  • TO-205AD
  • H (Linear Technology Package Code)
Variants
  • TO-39-3
  • TO-39-4
  • TO-39-6
  • TO-39-8
The height can also vary (e.g. low profile and high profile, see comments).
Similar To TO-18
Mounting TH
Pin Count 3-10 (most common pin count is 3)
Pitch 2.54mm (100mil)
Solderability Easy to solder by hand.
Thermal Resistance
  • T_{JC} = 15^{\circ}{\rm C}/W
  • T_{JA} = 150^{\circ}{\rm C}/W (mounted in the standard way to the PCB)
Land Area 88mm^2 (smallest square area to enclose package)
Height 3.18mm (when mounted flat with no standoff on PCB)
3D Models n/a
Common Uses
  • Transistors
  • UV LEDs
  • IR Thermometers

Comments:

The TO-39 package is a metallic can package used for hermetically sealing semiconductor devices. It usually has three legs (the TO-39-3 variant), but variants with up to 10 legs are in use. The metal case can be gold coated. As a large through-hole package, it is being used less in recent years, although it still finds applications with high-end, sensitive electronic devices such as UV LEDs and IR thermometers.

The TO-39 package has a small polarising tab on the side of the metal case. However this is merely an indication and does not prevent the user from inserting the package incorrectly. The 3-pin variant can only be inserted in one way because it’s 3 pins are not symmteric around the centre (it’s the same as the 4-pin version, but with one pin missing).

The TO-39 package comes in different heights, two of which are commonly called low profile and high profile.

The ground pin of the TO-39 package is usually connected to the metal case. The TO-39 can sit directly on the PCB, so it’s important to consider that it could short out any unmasked nets running underneath the package. This also applies to the pads surrounding the non-ground pins. I measured the clearance around the non-ground pins and the maximum diameter of the pad surrounding the hole was about 1.60mm before it would short to ground. The pad on the overside of the PCB can be as large as you want.

You can get clip-on heatsinks for the TO-39 package with thermal resistances of around 30-40^{\circ}{\rm C}/W., which drops the T_{JA} to around 45-55^{\circ}{\rm C}.

Images:

TO-92

Name Transistor Outline 92
Synonyms
  • Z Package (Analog Devices)
  • TO-226AA
  • 29-11 (On Semiconductor)
Variants n/a
Similar To TO-226
Mounting TH
Pin Count 3
Pitch 1.27mm (50mill)
Solderability Perfect for hand soldering and prototyping! Fits well into breadboards.
Thermal Resistance
  • 220^{\circ}{\rm C}/W (package only)
  • 175^{\circ}{\rm C}/W (plated through-holes)
  • 145^{\circ}{\rm C}/W (plated through-holes and 0.25inch^2 pad per lead)
Land Area n/a
Height n/a
3D Models n/a
Common Uses
  • Transistors
  • MOSFETs
  • Linear regulators
  • Active linear analogue temperature sensors
  • Digital 1-wire temperature sensors

Comments:

Very common package for low-power through-hole transistors, MOSFET’s, and linear regulators. It is similar to the TO-226, except that the TO-226 has a longer body. One dis-advantage with the TO-92 is that it cannot dissipate much heat compared to something like the TO-220AB through-hole package.

Images:

package-to-92-3d-render-with-pin-numbering 3D render of the TO-92 component package with pin numbering.

TO-93

Name Transistor Outline 93
Synonyms TO-209AB
Variants n/a
Similar To n/a
Mounting Panel Mount
Pin Count 4 (typ)
Pitch n/a (terminals and flying leads)
Solderability Designed for hand soldering/screw lugs
Thermal Resistance n/a
Land Area n/a (panel mount)
Height 49.5mm (exc. cable), 231mm (approx, cable fully extended)
3D Models n/a
Common Uses High-power SCR’s

Comments:

Large panel mount package used for high-power SCR’s. Has good heat-sinking capabilities. Thread is 28.5mm in diameter, so fits 29-30mm hole. The metal case/thread is usually used as the anode, and the thick cable the cathode (there normally is a flying lead for the cathode also), along with a white flying lead for the gate.

Images:

package-to-92-dimensions The dimensions for the TO-92 package.

TO-Leadless

Name Transistor Outline Leadless
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 8 + exposed pad
Pitch 1.20mm
Solderability Not suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques.
Thermal Resistance
  • R_{JC} = 0.4^{\circ}{\rm C}/W
  • R_{JA} = 40^{\circ}{\rm C}/W (max)
Dimensions 11.7×9.9×2.3mm
Land Area 116mm2
3D Models n/a
Common Uses
  • High-power MOSFETs (e.g. with 300A current capability)

Comments:

As far as I know, the TO-Leadless package is solely used by Infineon for a range of it’s high power MOSFETs. In this package, Infineons MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.

Images:

TO-PMOD-7

Name Transistor Outline Power Module 7
Synonyms TZA07A (Texas Instruments)
Variants n/a
Similar To n/a
Mounting SMD
Pin Count 7
Pitch 1.27mm (between the six pins, exluding the pad)
Solderability Easy to solder by hand, with a powerful soldering iron (the pad is the hardest part).
Thermal Resistance
  • T_{JC} = 1.9^{\circ}{\rm C}/W
  • T_{JA} = 16^{\circ}{\rm C}/W (with the recommended land pattern)
Land Area 10.16x13.77mm = 140mm^2
Height 4.57mm
3D Models TO-PMOD 7 Pin Package
Common Uses DC/DC power modules (e.g. buck, boost, buck/boost).

Comments:

This is a rather large SMD package with good heat sinking ability. Texas Instruments uses this package for some of their DC/DC power modules, which have built in shielded inductors.

Images:

to-pmod-7-component-package-dimensions-and-land-pattern The dimensions and recommended land pattern for the TO-PMOD-7 component package. Image from http://www.ti.com/.
to-pmod-7-3d-render-jpg A 3D model of the TO-PMOD-7 package.

TSOC

Name Thin Smal-Outline C-Lead
Synonyms D6 (Maxim)
Variants D6-1, D6N-1
Similar To n/a
Mounting SMD
Pin Count 6 (TSOC-6)
Pitch 1.27mm
Solderability Easy to solder by hand.
Thermal Resistance n/a
Dimensions
  • 3.94×4.29×1.40mm, LA: 17.6mm2 (D6-1)
  • 3.94×4.62×1.40mm, LA: 18.9mm2 (D6N-1)
Height 1.40mm
3D Models TSOC-6
Common Uses

Comments:

As far as I can tell, this package only comes in the 6-pin version (TSOC-6), and is only used by Dallas/Maxim (since 2001, Dallas has been a subsidiary of Maxim). There are two variants, with the difference between them being the package width and the lead length (and hence two slightly different land patterns).

Images:

TSSOP

Name Thin Scale Small Outline Package
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count n/a
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses IC’s

Comments:

None

TQFP

Name Thin Quad Flat Pack
Synonyms n/a
Variants n/a
Similar To n/a
Mounting SMD
Pin Count n/a
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses IC’s

Comments:

The thin-quad-flat-pack package is a leaded, thin SMT package commonly used for micron-controllers and such. It’s quite easy to solder these packages and easy enough to probe the individual pins afterwards when testing also.

uMAX

See MSOP.

uSOP

See MSOP.

UQFN

Name Ultra-thin Quad Flat Non-leaded
Synonyms n/a
Variants n/a
Similar To QFNVQFN
Mounting SMD
Pin Count 4
Pitch 5.08mm (200mill)
Solderability Can be soldered with a soldering iron with moderate experience, as long as it doesn’t have a centre pad.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses IC’s

Comments:

An ultra-thin QFN package. Commonly used for packaging 4 or 5 TVSdiodes together.

VQFN

Name Very-thin Quad Flat Non-leaded
Synonyms n/a
Variants n/a
Similar To QFNUQFN
Mounting SMD
Pin Count n/a
Pitch n/a
Solderability Can be soldered with a soldering iron with moderate experience, as long as it doesn’t have a centre pad.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses IC’s

Comments:

These packages don’t have leads, instead all of the pins are present as pads the run around the outside of the package. They are kind of a intermediary between leaded packages and ball-grid arrays. The pads are mostly on the bottom of the chip, although a little of the pad creeps around the corner and is visible from the side, hence they are ‘kind of’ hand solderable. However, the side section of the pad is not normally tinned (well not in the ‘sawn’ version of the package), which means it can be hard to get solder to stick to it. Not recommended for DIY purposes unless you have an oven! However in a commercial situation they are better since they offer better electrical and thermal characteristics than leaded packages. The improved thermal characteristic mainly come from the large metal pad the covers the bottom centre of the chip. This is either connected to ground or left floating, but offers great thermal conductivity when it is soldered (this definitely requires an oven to do). Check out the nice VQFN Design Guide by CML Micro.

WOG

Name WOG
Synonyms n/a
Variants n/a
Similar To n/a
Mounting TH
Pin Count 4
Pitch 5.08mm (200mill)
Solderability Easily soldered with a soldering iron
Thermal Resistance n/a
Land Area n/a
Height 10mm (can vary from 4-25mm due to the long through-hole leads)
3D Models n/a
Common Uses Bridge rectifier’s

Comments:

A cheap, cylindrical plastic package used for smaller (low power) through-hole full-bridge rectifiers. Uses a glass-passivated construction.

Images:

package-wog-2d-dimensions Dimensioned orthographic drawing of the WOG component package.

Chip Packages And The EIAJ Standard

The following are a description of the most popular chip packages. Chip packages are standardized small SMT footprints primarily used for 2 lead passive components such as resistors, capacitors and ferrite beads. They are defined by the total footprint width and height, respectively (assuming the two footprint pads are on the left and right rather than the top or bottom, or more formally, the axis of the component runs parallel to the width). The standard is to define them in the metric scale, however most manufacturers, and hence suppliers still use the imperial units. In metric units, the format is to use two number each to describe the width and height in tenth’s of a millimeter, e.g. a chip package size ’2012′ tells you the width is 2.0mm and the height is 1.2mm. In imperial, the numbers are in hundreths of an inch (which is NOT mills; that is thousandth’s of an inch). For example, an 0805 chip package tells you the width is 0.08inch, and the height 0.05inch. This is equivalent to the ’2012′ metric representation. Below is a short description on the most popular chip packages. The imperial size of the footprint is listed first, and then the metric equivalent is followed in brackets.

Sorted from smallest to largest package size.

Package Designator (metric) Package Designator (imperial) Typical Power Rating (W): Land Area Comments:
 ? 01005 1/32 Ridiculously small chip package that can barely be seen by the naked eye.
0603 0201 1/20 0.12mm2 Small chip package that is unsolderable by hand (it is just too small). BE CAREFUL NOT TO GET THE METRIC SIZE CONFUSED AS AN IMPERIAL as an 0603 imperial also exists!
1005 0402 1/16 0.5mm2 These are too small for ‘legitimate’ hand soldering, but it can be done. A common size for resistors and small valued capacitors in the pico/nanofarad range.
1608 0603 1/16 1.28mm2 This package supports all resistors, and ceramic capacitors up to 10uF. My favourite package size! You can easily solder these with a little experience. You can route a small track between the pads (given a distance of 0.6mm between the inside edges of the two pads, this just allows for a 0.2mm track and 0.2mm gap on each side, which is a common minimum clearance rule).
2012 0805 1/10 2.4mm2 Supports ceramic capacitors up to 47uF. You can easily route a track between the two pads.
2518 1007 ? 4.5mm2 Commonly used for chip inductors are the 100uH, 250mA mark.
3216 1206 1/8 5.1mm2 One of the larger forms of SMT resistor/cap packages. Many of the bigger valued ceramic capacitors (100uF and up), come in this package, as well as the higher wattage resistors. Although smaller than their through-hole equivalents, 1206 components still take up a considerable amount of space on a PCB. Very easy to hand solder though!
3225 1210 1/4 8.0mm2 Slightly fatter version of the 3216, and hence can handle more power.
4516 1806 ? 7.2mm2 ?
4532 1812 1/2 14.4mm2
5025 2010 1/2 12.5mm2
6432 2512 1 20.48mm2 One of the largest SMT chip packages you can get. Limited supply of components in this package, mainly power and current-sense resistors.

The following image shows how you can easily route an 0.2mm thick trace between the pads of a 0805 component.

routing-between-0805-footprints Routing between the pads of a 0805 footprint (in Altium).

The following image is of 0603 (imperial) SMD components inside a small container.

smd-container-open-and-closed A container from DealExtreme used for holding SMD components (capacitors in this picture)

SMD Chip Resistors

The following table shows the range of chip resistors package sizes (based on the EIAJ Chip Packages above), and typical parameters for each. Note that the maximum current rating is based on the thermal properties of the package and its leads, and does not take into account the actual resistance of the resistor (e.g. tested with a 0Ω). Obviously, the actual allowable current is likely to be much less due to resistance.

Package
Designator
(metric)
Package
Designator
(imperial)
Maximum
Current
(A, typical)
Has Printed Value
1005 0402 1 No
1608 0603 1 Yes
2012 0805 2 Yes
3216 1206 2 Yes
3225 1210 3 Yes
5025 2010 3 Yes
6432 2512 3 Yes

SMD Tantalum Capacitors

Most SMD tantalum capacitors follow a standard set of sizes given in the following table. Most are almost rectangular, but if you look closely some the the faces are slightly angled. They are typically orange in colour. Kemet and AVX (two large manufacturers of these caps) label the packages slightly differently.

Kemet Code AVX Code Length (mm) Width (mm) Height (mm) EIA Standard
S S 3.2 1.6 1.2 EIA 3216-12
A A 3.2 1.6 1.8 EIA 3216-18
T T 3.5 2.8 1.2 EIA 3528-12
B B 3.5 2.8 2.1 EIA 3528-21
U W 6.0 3.2 1.5 EIA 6032-15
C C 6.0 3.2 2.8 EIA 6032-28
E V 7.2 6.0 3.8 EIA 7260-38
V Y 7.3 4.3 2.0 EIA 7343-20
D D 7.3 4.3 3.1 EIA 7343-31
X E 7.3 4.3 4.3 EIA 7343-43

Electrolytic SMD Capacitor Package Sizes

The following image shows the package sizes for Panasonics electrolytic SMD capacitors. These Panasonic cap ranges (there are quite a few series) are commonly used when requiring SMD electrolytics.

standard-panasonic-electrolytic-smd-cap-package-sizes Panasonic electrolytic SMD cap package sizes. Image from 'Panasonic Aluminium Electrolytic Capacitors: Series SV' (http://industrial.panasonic.com/www-data/pdf/ABA0000/ABA0000CE2.pdf).

The following image shows the recommend land pattern for each of the sizes mentioned above.

panasonic-electrolytic-smd-cap-land-patterns Recommended panasonic electrolytic SMD capacitor land patterns. Image from 'Panasonic SMT Aluminium Electrolytic Capacitors: Application Guidelines' (http://www.panasonic.com/industrial/components/pdf/aluminum_app_dne.pdf).

The following table shows the relationship between Panasonic cap packages and Chemi-Con cap packages.

Panasonic Code: Chemi-Con Code:
A B
B D
C E
D F
E/F H
G J
n/a K
H n/a
J L
K M

Inductor Sizes

Inductor sizes are semi-standardized, that is, there are a few manufacturers that have a few ranges of inductors which follow standard footprints.

Package Name (Imperial) Package Name (Metric) Dimensions Land Area
1515 4040 4.0×4.0mm 16mm2

Battery Sizes

PP3

Name PP3
Synonyms n/a
Variants n/a
Similar To n/a
Mounting Snap Contacts
Pin Count 2
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Dimensions n/a
3D Models n/a
Common Uses 9V batteries

Comments:

This is the most common 9V battery size. This is the battery size used in smoke alarms, remote control toys e.t.c. Most 9V battery chemistry come in the shape, including alkaline, lithium iron disulphide, lithium manganese dioxide and zinc chloride.

PP9

Name PP9
Synonyms n/a
Variants n/a
Similar To n/a
Mounting Snap Contacts
Pin Count 2
Pitch n/a
Solderability n/a
Thermal Resistance n/a
Dimensions 81(h)x66(w)x52(d)mm
3D Models n/a
Common Uses 9V batteries

Comments:

A less common 9V battery size. Zinc carbon 9V batteries come in this package.

SIM Cards

There a four standard SIM card sizes.

Name LxWxH (mm) Applicable Standards Comments
Standard SIM/Full-size (FF) 85.60×53.98×0.76 ISO/IEC 7810:2003, ID-1 This SIM card is the size of a credit card! Not used by many devices.
Mini-SIM (2FF) 25.00×15.00×0.76 ISO/IEC 7810:2003, ID-000 This is one of the most popular SIM card sizes.
Micro-Sim (3FF) 15.00×12.00×0.76 ETSI TS 102 221 V9.0.0, Mini-UICC
Nano-SIM 12.30×8.80×0.67 ETSI TS 102 221 V11.0.0
Embedded-SIM 6.00×5.00x<1.00 JEDEC Design Guide 4.8, SON-8 Designed to be directly mounted onto a circuit board.

Break-out Boards

Break-out boards are useful for converting one package footprint into another. They are particular common for converting smaller SMT package footprints into 100mil DIP packages for prototyping with modern IC’s.

If not brought from the right place, these break-out board’s can be very expensive!

SparkFun is the cheapest supplier of break-out boards that I’ve found. Element14 also sells them, but at a much higher price.

External References

If there is one other site I would direct you to for PCB information, it would be Tom Hausherr’s blog on the Mentor Graphics website.

Fairchild Surface Mount Packaging Information - An extensive database of most surface mount footprints and their variants that are out on the market. Each footprint has a pdf with a technical drawing of the package and a recommended land pattern (the dimensions and orientation of the pads you would use to make the PCB). Although this is made by Fairchild, since the packages are pretty standardized, this should apply to any manufacturer. Although just to be on the safe side, use the actual manufacturers data if they supply it (some don’t and most make it incredibly hard to find).

3D models (which can be imported into Altium as step files) can be downloaded from 3D Content Central (www.3dcontentcentral.com). It is a combination of content submitted from both users and suppliers, can contains many standard component packages in 3D.

SiliconFarEast “IC Package Types” (http://www.siliconfareast.com/ic-package-types.htm) – A short but tidy graphical table describing most footprints. Also has data on the body size, body thickness, and lead pitch for the most common variants of each package.

The SMT Code Book (http://www.marsport.org.uk/smd/mainframe.htm) – Handy database for working out what small SMT components are. Since there is usually not enough space to print the entire part number, most manufacturers print their own kind of code of small SMT components. This makes it really hard to determine what they are. To make matters worse, many manufacturers use the same code for different components, and sometimes the manufacturer releases two components with the same code! The trick is to be able to identify the package and the code, and together you can get a good idea of what the component is. The SMT Code Book lists over 3,500 SMT device codes in alphabetical order.

Answers.com’s Surface-mount Technology page. Broad spectrum of information regarding SMT components, the production methods and package sizes.

Suggested Pad Layouts For A Number Of Packages (Diodes INC)

PDF

Suggested Pad Layouts For A Number Of Packages (Diodes INC) – Many recommended pad layouts/land patterns for common packages all in one PDF!

Quick-tecks SMT Package Dimensions PDF, which contains hundreds of dimensions for common SMD component packages. You can download it from here, or alternatively, use the file stored on this site below.

Quick-teck Internal Technical Report - SMT Package Dimensions
Quick-teck Internal Technical Report - SMT Package Dimensions
Quick-teck Internal Technical Report - SMT Package Dimensions.pdf
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